Inventor · disambiguated record
Cheonil Park
Also filed as: PARK CHEONIL
1 granted patent·4 pending applications·0 citations·filing 2019–2024
10Inventor score
Top patents by PatentIndex Score
5 records- 0151US2025214181A1Solder composition, method of preparing the same, and method of manufacturing semiconductor package using the solder compositionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0249US2023212440A1Adhesive composition and wafer processing tape including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0347US12354879B2Method of fabricating semiconductor device and method of separating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 0447US2022233300A1METHOD OF MANUFACTURING ePTFE ARTIFICIAL VASCULAR GRAFT WITH IMPROVED BLOOD COMPATIBILITY BY SELECTIVE PLASMA ETCHINGSEOUL NAT UNIV R&DB FOUNDATION·Filed 2019·Application pending·0 cites
- 0540US2024087940A1Wafer temporary adhesive tape, wafer stack structure, and method of processing semiconductor wafer by using the wafer temporary adhesive tapeSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →