Inventor · disambiguated record
Chang Hwa Park
Also filed as: PARK CHANG HWA
21 granted patents·9 pending applications·26 citations·filing 2009–2025
91Inventor score
Files withSAMSUNG ELECTRO MECH25LG INNOTEK CO LTD2CHO IN KUK1PARK CHANG HWA1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
30 records- 0187US10580575B2Dielectric composition and multilayer ceramic capacitor containing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 3, 2020·2 cites·19 claims
- 0287US10453790B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 22, 2019·5 cites·14 claims
- 0386US11587878B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 21, 2023·1 cites·4 claims
- 0483US11183462B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0579US10600572B2Dielectric composition and multilayer ceramic capacitor containing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 24, 2020·1 cites·13 claims
- 0678US8564107B2Lead frame and method for manufacturing the sameCHO IN KUK·Filed 2010·Granted Oct 22, 2013·9 cites·18 claims
- 0773USRE49923EDielectric composition and multilayer ceramic capacitor containing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 16, 2024·0 cites·25 claims
- 0872US11229118B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 18, 2022·1 cites·14 claims
- 0971US11574775B2Dielectric powder and multilayer capacitor using the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 7, 2023·0 cites·17 claims
- 1070US10593482B2Dielectric powder and multilayer capacitor using the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 17, 2020·0 cites·16 claims
- 1168US10903013B2Dielectric powder and multilayer capacitor using the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jan 26, 2021·0 cites·17 claims
- 1262US12495496B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 1362US8945951B2Lead frame and manufacturing method thereofPARK CHANG HWA·Filed 2009·Granted Feb 3, 2015·4 cites·14 claims
- 1462US2025311100A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 1559US11251133B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 15, 2022·0 cites·16 claims
- 1659US2025016921A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1758US2025081338A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1857US2025056727A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1957US2024431023A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2056US2025203774A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2156US2024395682A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2255US2025107008A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2355US2025126707A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2452US11631643B2Substrate embedded electronic component packageSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 2552US9788438B2Printed circuit board for memory cardLG INNOTEK CO LTD·Filed 2012·Granted Oct 10, 2017·1 cites·5 claims
- 2649US11490503B2Substrate with electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 2748US11075156B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·0 cites·19 claims
- 2846US9661750B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2012·Granted May 23, 2017·0 cites·18 claims
- 2943US11640952B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·19 claims
- 3031US10685929B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 16, 2020·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →