Inventor · disambiguated record
Chi-Chun Peng
Also filed as: PENG CHI-CHUN
5 granted patents·11 pending applications·2 citations·filing 2022–2025
66Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16
Top patents by PatentIndex Score
16 records- 0191US12009337B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0283US2025357418A1Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0381US2025364302A1Vacuum chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0481US2025364301A1Vacuum chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0580US12438118B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0672US12412773B2Vacuum chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0768US12322615B2De-tape toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 0868US2025273492A1De-tape toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0960US2025367865A1Die ejector having independently engaged ejector rods, method of performing die pick-up with the die ejector, and die ejector system including the die ejectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025391810A1Systems for optical oxide detection in semiconductor devices and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1155US12362317B2Semiconductor die dipping structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1255US2025062274A1Bonding apparatus and method of manufacturing an integrated circuit package using the apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1355US2025054786A1Die bonding tool with movable component for improved die protrusion control and methods for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1454US2025006690A1Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024234481A1Semiconductor device with inductive component and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1650US2024047255A1Wafer alignment assembly of the solder reflow systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →