Inventor · disambiguated record
Ching-Nen Peng
Also filed as: PENG CHING-NEN
52 granted patents·166 citations·filing 2011–2022
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40WANG MILL-JER8LIN HUNG-CHIH2CHEN CHUN-CHENG1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
52 records- 0197US9664707B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 0297US9453877B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 27, 2016·9 cites·20 claims
- 0397US9341671B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·14 cites·20 claims
- 0496US10067181B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·5 cites·20 claims
- 0595US9086452B2Three-dimensional integrated circuit and method for wireless information access thereofWANG MILL-JER·Filed 2012·Granted Jul 21, 2015·26 cites·20 claims
- 0694US10698026B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 0794US10652987B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·5 cites·20 claims
- 0893US8957691B2Probe cards for probing integrated circuitsWANG MILL-JER·Filed 2011·Granted Feb 17, 2015·12 cites·22 claims
- 0992US11340291B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 1091US8922230B23D IC testing apparatusWANG MILL-JER·Filed 2011·Granted Dec 30, 2014·10 cites·14 claims
- 1190US9372227B2Integrated circuit test system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·10 cites·17 claims
- 1289US8421073B2Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2011·Granted Apr 16, 2013·10 cites·20 claims
- 1386US10073135B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·2 cites·20 claims
- 1486US9900970B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·19 claims
- 1586US9252593B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 2, 2016·4 cites·15 claims
- 1685US9754847B2Circuit probing structures and methods for probing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·20 claims
- 1785US9671457B23D IC testing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·5 cites·18 claims
- 1885US9658281B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
- 1982US11579190B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 14, 2023·0 cites·20 claims
- 2082US10641819B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 2182US9568543B2Structure and method for testing stacked CMOS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·5 cites·18 claims
- 2280US8866488B2Power compensation in 3DIC testingWANG MILL-JER·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 2378US11852672B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2478US9653927B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·20 claims
- 2577US9417285B2Integrated fan-out package-on-package testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·4 cites·17 claims
- 2676US9891266B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·2 cites·20 claims
- 2775US8956889B2Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2013·Granted Feb 17, 2015·3 cites·20 claims
- 2872US11387683B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 2972US11231453B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 3071US11467203B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 3171US11229109B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 3271US9880201B2Systems for probing semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·1 cites·20 claims
- 3368US9129973B2Circuit probing structures and methods for probing the sameWANG MILL-JER·Filed 2011·Granted Sep 8, 2015·2 cites·19 claims
- 3466US10718790B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·19 claims
- 3565US8952711B2Methods for probing semiconductor wafersWANG MILL-JER·Filed 2011·Granted Feb 10, 2015·1 cites·20 claims
- 3664US9640447B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 2, 2017·1 cites·20 claims
- 3764US8614105B2Production flow and reusable testing methodWANG MILL-JER·Filed 2011·Granted Dec 24, 2013·1 cites·25 claims
- 3863US9448285B2Method and apparatus of wafer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·1 cites·18 claims
- 3963US9310437B2Adaptive test sequence for testing integrated circuitsCHEN CHUN-CHENG·Filed 2011·Granted Apr 12, 2016·2 cites·11 claims
- 4061US11249112B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 4161US10790707B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·20 claims
- 4259US10274518B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·20 claims
- 4357US10164480B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4456US10725090B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 4554US9354254B2Test-yield improvement devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·0 cites·20 claims
- 4651US11726112B2Electromagnetic shielding during wafer stage testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 4750US9234940B2Integrated fan-out wafer architecture and test methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 4849US9606155B2Capacitance measurement circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 28, 2017·0 cites·20 claims
- 4948US8836355B2Dynamic testing based on thermal and stress conditionsWANG MILL-JER·Filed 2011·Granted Sep 16, 2014·0 cites·20 claims
- 5044US9915699B2Integrated fan-out pillar probe systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 13, 2018·0 cites·20 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →