Inventor · disambiguated record
Chih-Ping Peng
Also filed as: PENG CHIH-PING
14 granted patents·26 citations·filing 2006–2022
88Inventor score
Top patents by PatentIndex Score
14 records- 0181US7838985B2Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layersVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Nov 23, 2010·9 cites·6 claims
- 0280US12370655B2Hand tool capable of switching operating directionPENG CHIH PING·Filed 2022·Granted Jul 29, 2025·1 cites·6 claims
- 0372US9202935B2Zener diode haviing a polysilicon layer for improved reverse surge capability and decreased leakage currentVISHAY GEN SEMICONDUCTOR LLC·Filed 2013·Granted Dec 1, 2015·2 cites·7 claims
- 0472US8138597B2Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layerCHIANG WAN-LAN·Filed 2010·Granted Mar 20, 2012·3 cites·11 claims
- 0571US7915728B2Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereofVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Mar 29, 2011·5 cites·5 claims
- 0666US10163762B2Lead frame with conductive clip for mounting a semiconductor die with reduced clip shiftingVISHAY GEN SEMICONDUCTOR LLC·Filed 2015·Granted Dec 25, 2018·2 cites·19 claims
- 0766US9966429B2Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage currentVISHAY GEN SEMICONDUCTOR LLC·Filed 2015·Granted May 8, 2018·1 cites·17 claims
- 0866US9331142B2Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage currentVISHAY GEN SEMICONDUCTOR LLC·Filed 2015·Granted May 3, 2016·1 cites·7 claims
- 0965US7489071B2Field emission system and method for improving its vacuumIND TECH RES INST·Filed 2006·Granted Feb 10, 2009·2 cites·23 claims
- 1053US7780494B2Method for maintaining vacuum-tight inside a panel module and structure for the sameIND TECH RES INST·Filed 2009·Granted Aug 24, 2010·0 cites·7 claims
- 1148US8796840B2Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layersCHIANG WAN-LAN·Filed 2012·Granted Aug 5, 2014·0 cites·9 claims
- 1248US7821189B2Method for maintaining vacuum-tight inside a panel module and structure for the sameIND TECH RES INST·Filed 2006·Granted Oct 26, 2010·0 cites·9 claims
- 1342US8252633B2Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereofCHIANG WAN-LAN·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 1441US9041188B2Axial semiconductor packageVISHAY GEN SEMICONDUCTOR LLC·Filed 2012·Granted May 26, 2015·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →