Inventor · disambiguated record
Cheng Poh Pour
Also filed as: POUR CHENG P · POUR CHENG POH
16 granted patents·1 pending application·162 citations·filing 2002–2019
94Inventor score
Top patents by PatentIndex Score
17 records- 0197US7309623B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 18, 2007·45 cites·23 claims
- 0293US7282390B2Stacked die-in-die BGA package with die having a recessMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·19 cites·20 claims
- 0387US7282392B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·8 cites·21 claims
- 0486US7799610B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 21, 2010·7 cites·25 claims
- 0584US8373277B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 12, 2013·6 cites·7 claims
- 0682US7358117B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 15, 2008·5 cites·36 claims
- 0781US7332820B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 19, 2008·16 cites·84 claims
- 0880US7332819B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 19, 2008·16 cites·67 claims
- 0979US7575953B2Stacked die with a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 18, 2009·4 cites·22 claims
- 1078US7344969B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·13 cites·70 claims
- 1176US7371608B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted May 13, 2008·12 cites·42 claims
- 1272US9543166B2External gettering method and deviceMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·1 cites·16 claims
- 1366US10892202B2External gettering method and deviceMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 12, 2021·0 cites·17 claims
- 1465US7061124B2Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masksMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·10 cites·23 claims
- 1560US10453761B2External gettering method and deviceMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 22, 2019·0 cites·7 claims
- 1658US2013154117A1Stacked die in die bga packageMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1751US9177828B2External gettering method and deviceTAN MICHAEL·Filed 2011·Granted Nov 3, 2015·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →