Inventor · disambiguated record
Charles A. Poutasse
Also filed as: POUTASSE CHARLES · POUTASSE CHARLES A · POUTASSE III CHARLES A
14 granted patents·2 pending applications·339 citations·filing 1994–2023
94Inventor score
Top patents by PatentIndex Score
16 records- 0192US5622782AFoil with adhesion promoting layer derived from silane mixtureGOULD INC·Filed 1994·Granted Apr 22, 1997·100 cites·16 claims
- 0283US6132851AAdhesive compositions and copper foils and copper clad laminates using sameGA TEK INC·Filed 1994·Granted Oct 17, 2000·27 cites·19 claims
- 0382US6296949B1Copper coated polyimide with metallic protective layerGA TEK INC·Filed 1999·Granted Oct 2, 2001·58 cites·19 claims
- 0477US11001733B2Compositions for polishing cobalt and low-K material surfacesFUJIMI INC·Filed 2019·Granted May 11, 2021·1 cites·14 claims
- 0575US7201784B2Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectricsINTEL CORP·Filed 2003·Granted Apr 10, 2007·18 cites·13 claims
- 0666US5629098AEpoxy adhesives and copper foils and copper clad laminates using sameGOULD ELECTRONICS INC·Filed 1995·Granted May 13, 1997·27 cites·8 claims
- 0765US6117536AAdhesion promoting layer for use with epoxy prepregsGA TEK INC·Filed 1998·Granted Sep 12, 2000·20 cites·21 claims
- 0864USRE39615EAdhesive compositions and copper foils and copper clad laminates using sameNIKKO MATERIALS USA INC·Filed 2002·Granted May 8, 2007·5 cites·19 claims
- 0956US6268070B1Laminate for multi-layer printed circuitGOULD ELECTRONICS INC·Filed 1999·Granted Jul 31, 2001·20 cites·14 claims
- 1054US6221176B1Surface treatment of copper to prevent microcracking in flexible circuitsGOULD ELECTRONICS INC·Filed 1999·Granted Apr 24, 2001·17 cites·11 claims
- 1153US2025206985A1Polishing compositionFUJIMI INC·Filed 2023·Application pending·0 cites
- 1250US5614324AMulti-layer structures containing a silane adhesion promoting layerGOULD ELECTRONICS INC·Filed 1995·Granted Mar 25, 1997·15 cites·20 claims
- 1350US5525433AEpoxy adhesives and copper foils and copper clad laminates using sameGOULD ELECTRONICS INC·Filed 1995·Granted Jun 11, 1996·17 cites·19 claims
- 1448US6299721B1Coatings for improved resin dust resistanceGOULD ELECTRONICS INCL·Filed 1998·Granted Oct 9, 2001·10 cites·21 claims
- 1545US6589381B2Coatings for improved resin dust resistanceGOULD ELECTRONICS INC·Filed 2001·Granted Jul 8, 2003·4 cites·20 claims
- 1640US2020308447A1Compositions for polishing cobalt and low-k material surfacesFUJIMI CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →