Inventor · disambiguated record
Charles Rimbert-Riviere
Also filed as: RIMBERT-RIVIERE CHARLES
7 granted patents·4 pending applications·18 citations·filing 2016–2025
75Inventor score
Files withINFINEON TECHNOLOGIES AG11
Top patents by PatentIndex Score
11 records- 0193US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
- 0270US11217467B2Transport systemINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 4, 2022·1 cites·14 claims
- 0367US2025339926A1Method for dividing a curved ceramic mastercard into separate substratesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0458US12390887B2Method for separating substratesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Aug 19, 2025·0 cites·12 claims
- 0554US2024290707A1SubstrateINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0653US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 0752US2025062175A1Substrate and method of producing a substrateINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0851US10141199B2Selecting a substrate to be soldered to a carrierINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 27, 2018·1 cites·14 claims
- 0951US2024339416A1Substrate barcode readability enhancement structures and methodINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1049US12431395B2Semiconductor power module with crack sensingINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 1138US12205826B2Method for forming a semiconductor substrate arrangementINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 21, 2025·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →