Inventor · disambiguated record
Christopher L. Rumer
Also filed as: RUMER CHRISTOPHER · RUMER CHRISTOPHER L
29 granted patents·3 pending applications·1,186 citations·filing 2001–2020
97Inventor score
Top patents by PatentIndex Score
32 records- 0198US6924551B2Through silicon via, folded flex microelectronic packageINTEL CORP·Filed 2003·Granted Aug 2, 2005·652 cites·23 claims
- 0292US6748350B2Method to compensate for stress between heat spreader and thermal interface materialINTEL CORP·Filed 2001·Granted Jun 8, 2004·61 cites·12 claims
- 0389US7279362B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2005·Granted Oct 9, 2007·18 cites·8 claims
- 0489US7169687B2Laser micromachining methodINTEL CORP·Filed 2004·Granted Jan 30, 2007·43 cites·24 claims
- 0588US7303977B2Laser micromachining methodINTEL CORP·Filed 2004·Granted Dec 4, 2007·40 cites·17 claims
- 0688US6992891B2Metal ball attachment of heat dissipation devicesINTEL CORP·Filed 2003·Granted Jan 31, 2006·58 cites·18 claims
- 0786US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
- 0885US7473995B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Jan 6, 2009·39 cites·12 claims
- 0984US7311967B2Thermal interface material and electronic assembly having such a thermal interface materialINTEL CORP·Filed 2001·Granted Dec 25, 2007·28 cites·28 claims
- 1083US7611966B2Dual pulsed beam laser micromachining methodINTEL CORP·Filed 2005·Granted Nov 3, 2009·8 cites·17 claims
- 1182US7304381B2Package and method for attaching an integrated heat spreaderINTEL CORP·Filed 2006·Granted Dec 4, 2007·12 cites·25 claims
- 1282US7247517B2Method and apparatus for a dual substrate packageINTEL CORP·Filed 2003·Granted Jul 24, 2007·37 cites·15 claims
- 1381US6974723B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2004·Granted Dec 13, 2005·25 cites·3 claims
- 1480US7527090B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2003·Granted May 5, 2009·24 cites·13 claims
- 1580US6892927B2Method and apparatus for bonding a wire to a bond pad on a deviceINTEL CORP·Filed 2003·Granted May 17, 2005·29 cites·16 claims
- 1680US6841867B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2002·Granted Jan 11, 2005·24 cites·19 claims
- 1779US7897486B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2007·Granted Mar 1, 2011·7 cites·7 claims
- 1877US7846778B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Dec 7, 2010·24 cites·7 claims
- 1972US7996989B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2008·Granted Aug 16, 2011·4 cites·3 claims
- 2072US7619318B2No-flow underfill composition and methodINTEL CORP·Filed 2005·Granted Nov 17, 2009·4 cites·13 claims
- 2170US6982492B2No-flow underfill composition and methodINTEL CORP·Filed 2003·Granted Jan 3, 2006·14 cites·12 claims
- 2267US6911726B2Microelectronic packaging and methods for thermally protecting package interconnects and componentsINTEL CORP·Filed 2002·Granted Jun 28, 2005·10 cites·14 claims
- 2362US7059045B2Method for handling integrated circuit dieINTEL CORP·Filed 2003·Granted Jun 13, 2006·7 cites·13 claims
- 2458US7358606B2Apparatus to compensate for stress between heat spreader and thermal interface materialINTEL CORP·Filed 2004·Granted Apr 15, 2008·6 cites·15 claims
- 2556US11056466B2Package on package thermal transfer systems and methodsINTEL CORP·Filed 2019·Granted Jul 6, 2021·0 cites·18 claims
- 2651US10438930B2Package on package thermal transfer systems and methodsINTEL CORP·Filed 2017·Granted Oct 8, 2019·0 cites·23 claims
- 2749US2005214977A1Microelectronic packaging and methods for thermally protecting package interconnects and componentsRUMER CHRISTOPHER L·Filed 2005·Application pending·0 cites
- 2847US6867124B1Integrated circuit packaging design and methodINTEL CORP·Filed 2003·Granted Mar 15, 2005·3 cites·14 claims
- 2943US12002727B2Barrier structures for underfill containmentINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·13 claims
- 3038US2006088984A1Laser ablation methodINTEL CORP·Filed 2004·Application pending·0 cites
- 3136US2004238947A1Package and method for attaching an integrated heat spreaderINTEL CORP·Filed 2003·Application pending·0 cites
- 3235US11222877B2Thermally coupled package-on-package semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 11, 2022·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →