Inventor · disambiguated record
Chang Myung Ryu
Also filed as: RYU CHANG MYUNG · RYU CHANG W
13 granted patents·3 pending applications·130 citations·filing 2002–2023
90Inventor score
Files withSAMSUNG ELECTRO MECH6INVENSAS CORP4ST MICROELECTRONICS INC2HYUNDAI MOBIS CO LTD1RYU CHANG MYUNG1
Top patents by PatentIndex Score
16 records- 0196US7170384B2Printed circuit board having three-dimensional spiral inductor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Jan 30, 2007·53 cites·8 claims
- 0293US10705191B2Three-dimensional time-of-flight sensors for a transportation systemST MICROELECTRONICS INC·Filed 2017·Granted Jul 7, 2020·7 cites·18 claims
- 0392US7408120B2Printed circuit board having axially parallel via holesSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 5, 2008·27 cites·7 claims
- 0491US7888599B2Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·24 cites·3 claims
- 0578US7435911B2Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 14, 2008·7 cites·4 claims
- 0673US11373322B2Depth sensing with a ranging sensor and an image sensorST MICROELECTRONICS INC·Filed 2019·Granted Jun 28, 2022·2 cites·18 claims
- 0770US7282648B2Capacitor-embedded PCB having blind via hole and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 16, 2007·5 cites·6 claims
- 0867US8900464B2Method of making a microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2013·Granted Dec 2, 2014·1 cites·9 claims
- 0965US8461460B2Microelectronic interconnect element with decreased conductor spacingRYU CHANG MYUNG·Filed 2009·Granted Jun 11, 2013·3 cites·13 claims
- 1062US12179657B2Lamp device and control method thereofHYUNDAI MOBIS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 1159US7543264B2High frequency signal transmission line having ground line blocks to reduce noiseSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 2, 2009·1 cites·6 claims
- 1258US9524947B2Microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2014·Granted Dec 20, 2016·0 cites·9 claims
- 1356US9856135B2Microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 1451US2010044860A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerTESSERA INTERCONNECT MATERIALS·Filed 2009·Application pending·0 cites
- 1549US2013186944A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerINVENSAS CORP·Filed 2013·Application pending·0 cites
- 1642US2005086831A1Rear cover assembly for washing machine and dryer and washing system using the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →