Inventor · disambiguated record
Chayathorn Saklang
Also filed as: SAKLANG CHAYATHORN
10 granted patents·7 pending applications·8 citations·filing 2014–2025
79Inventor score
Top patents by PatentIndex Score
17 records- 0183US10340211B1Sensor module with blade insertNXP BV·Filed 2018·Granted Jul 2, 2019·5 cites·20 claims
- 0276US10790220B2Press-fit semiconductor deviceNXP BV·Filed 2018·Granted Sep 29, 2020·3 cites·20 claims
- 0367US12469773B2Semiconductor device with attached battery and method thereforNXP USA INC·Filed 2022·Granted Nov 11, 2025·0 cites·14 claims
- 0467US2025266335A1Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2025·Application pending·0 cites
- 0566US12406911B2Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 0656US2025079335A1Vibration isolation assemblies for electronic devicesNXP USA INC·Filed 2023·Application pending·0 cites
- 0755US2024425367A1Die stacking with controlled angular alignmentNXP USA INC·Filed 2023·Application pending·0 cites
- 0854US2025210479A1Methods for battery connection in microelectronic packagesNXP USA INC·Filed 2023·Application pending·0 cites
- 0952US12125771B2Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereofNXP BV·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 1052US2024332105A1Multidevice package with recessed mounting surfaceNXP USA INC·Filed 2023·Application pending·0 cites
- 1151US2025085182A1Low stress packaging for environmental sensorsNXP USA INC·Filed 2023·Application pending·0 cites
- 1250US11482478B2Shielded electronic package and method of fabricationNXP BV·Filed 2020·Granted Oct 25, 2022·0 cites·16 claims
- 1345US11114239B2Electronic device, device package, and method of fabricationNXP BV·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 1444US11049817B2Semiconductor device with integral EMI shieldNXP BV·Filed 2019·Granted Jun 29, 2021·0 cites·19 claims
- 1542US9721877B1Method of mounting passive electronic component on lead frameNexperia BV·Filed 2016·Granted Aug 1, 2017·0 cites·21 claims
- 1641US9824980B2Lead finger locking structureNXP BV·Filed 2014·Granted Nov 21, 2017·0 cites·20 claims
- 1734US2017033034A1Electronic device and packageNXP BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →