Inventor · disambiguated record
Ching-Kai Shen
Also filed as: SHEN CHING-KAI
16 granted patents·2 pending applications·12 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
18 records- 0189US10556792B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·3 cites·20 claims
- 0287US10961118B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 0385US11772960B2Method of forming dielectric and metal sealing layers on capping structure of a MEMs deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 0482US2025333295A1Micro-electromechanical systems (mems) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0581US12202724B2Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent holeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0678US2024286889A1Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0777US10266396B2MEMS device with enhanced sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 0876US10961114B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 0972US12017908B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1072US11807520B2Semiconductor structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1171US9422151B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·1 cites·20 claims
- 1270US12441604B2Micro-electromechanical systems (MEMS) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1370US12074110B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1469US10899608B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 1561US11851318B2MEMS device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1661US8910523B2Capacitive accelerometerSHEN CHING-KAI·Filed 2012·Granted Dec 16, 2014·2 cites·18 claims
- 1756US11276670B2Semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1853US11462478B2Layer for buffer semiconductor device including microelectromechnical system (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →