Inventor · disambiguated record
Chi-Hsiang Shen
Also filed as: SHEN CHI-HSIANG
14 granted patents·16 pending applications·4 citations·filing 2018–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30
Top patents by PatentIndex Score
30 records- 0186US11772228B2Chemical mechanical polishing apparatus including a multi-zone platenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 0284US11482450B2Methods of forming an abrasive slurry and methods for chemical- mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0381US2023294237A1External heating system for use in chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0478US12224179B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0578US2025357100A1Processing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US12508685B2Semiconductor device fabrication methods and devices for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0776US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0876US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0974US10937691B2Methods of forming an abrasive slurry and methods for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 1073US11633829B2External heating system for use in chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 25, 2023·0 cites·20 claims
- 1171US11637021B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 1271US2025312886A1Device and method for improved cmp process with cmp headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1370US2025312891A1Chemical mechanical polishing system with conditioning ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1470US2025353140A1Polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1569US2023364733A1Chemical Mechanical Polishing Apparatus Including a Multi-Zone PlatenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1669US2025312889A1Chemical mechanical polishing system with polishing pad height measurement sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1767US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1867US2025312884A1Polishing pad with heat dissipation patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1964US11094555B2CMP slurry and CMP methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 2063US2025303329A1Filter with metal-organic framework for cmp processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2162US2024383092A1Polishing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2260US11037799B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 2359US2025372435A1System and method for cleaning a wafer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2458US2025349562A1Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2557US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2657US2025339932A1Conditioning pad with deposited diamond coatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2756US2025353134A1Heat cleaning system and method for cmp pad by-product controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2855US2024420978A1Retaining ring for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2954US10692732B2CMP slurry and CMP methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 3045US11133247B2Vias with metal caps for underlying conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →