Inventor · disambiguated record
Chao-Wen Shih
Also filed as: SHIH CHAO W · SHIH CHAO-WEN
136 granted patents·46 pending applications·544 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD139PHOENIX PREC TECHNOLOGY CORP16HON HAI PREC IND CO LTD5HSU SHIH-PING5TAIWAN SEMICONDUCTOR MFG5
Top patents by PatentIndex Score
182 records- 0199US11658069B2Method for manufacturing a semiconductor device having an interconnect structure over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·9 cites·20 claims
- 0299US11233035B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·8 cites·20 claims
- 0398US11742297B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0498US11502062B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·12 cites·20 claims
- 0598US10354964B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·21 cites·20 claims
- 0698US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
- 0797US11855333B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0897US11587894B2Package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·12 cites·20 claims
- 0997US11417629B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·16 claims
- 1097US11335655B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·4 cites·20 claims
- 1197US10490479B1Packaging of semiconductor device with antenna and heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·16 cites·20 claims
- 1297US10186492B1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·16 cites·20 claims
- 1396US11164848B2Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·6 cites·20 claims
- 1496US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 1595US11916012B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 1695US11264362B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 1795US11024605B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·11 cites·20 claims
- 1895US10157807B2Sensor packages and manufacturing mehtods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·10 cites·19 claims
- 1994US11784163B2Stacking structure, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 2094US8865521B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 21, 2014·16 cites·20 claims
- 2193US11069608B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·6 cites·20 claims
- 2293US10483617B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
- 2393US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 2493US9305877B13D package with through substrate viasTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
- 2592US12154875B2Package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·20 claims
- 2692US11056438B2Semiconductor packages and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·5 cites·20 claims
- 2792US10636713B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 2892US9284111B2Automatic pill grasping apparatusHON HAI PREC IND CO LTD·Filed 2014·Granted Mar 15, 2016·29 cites·18 claims
- 2991US11705409B2Semiconductor device having antenna on chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 3091US11322477B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 3191US2025343136A1Conductive Traces in Semiconductor Devices and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3290US11114413B2Stacking structure, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·5 cites·20 claims
- 3390US10971460B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 3489US11562983B2Package having multiple chips integrated therein and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·20 claims
- 3588US12406965B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 3688US2025336892A1PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3787US10475757B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 12, 2019·3 cites·20 claims
- 3887US10312203B2Structure and formation method of chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·4 cites·20 claims
- 3986US12451426B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 4086US12355008B2Methods of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 4186US12266847B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 4286US12266619B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 4386US11705411B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 4486US10867929B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 4586US10510693B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 4686US9035468B2Copper post structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 19, 2015·8 cites·19 claims
- 4786US8669651B2Package-on-package structures with reduced bump bridgingYANG CHUNG-YING·Filed 2010·Granted Mar 11, 2014·9 cites·15 claims
- 4886US7174630B2Method for fabricating connection terminal of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Feb 13, 2007·15 cites·14 claims
- 4986US2025343124A1Multi-liner tsv structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5085US12463133B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
Showing the top 50 of 182 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →