Inventor · disambiguated record
Chiaki Shimizu
Also filed as: SHIMIZU CHIAKI
0 granted patents·3 pending applications·0 citations·filing 2021–2024
Files withRESONAC CORP3
Top patents by PatentIndex Score
3 records- 0156US2025387833A1Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal pasteRESONAC CORP·Filed 2024·Application pending·0 cites
- 0243US2024105653A1Solder paste, method for forming solder bumps, and method for producing member with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 0343US2024297135A1Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →