Inventor · disambiguated record
Chia-Pao Shu
Also filed as: SHU CHIA-PAO
13 granted patents·73 citations·filing 2010–2015
90Inventor score
Top patents by PatentIndex Score
13 records- 0196US8716852B2Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the sameSHU CHIA-PAO·Filed 2012·Granted May 6, 2014·26 cites·20 claims
- 0292US9365416B2Structure and method for motion sensorSHU CHIA-PAO·Filed 2012·Granted Jun 14, 2016·12 cites·31 claims
- 0389US9266714B2Micro-electro mechanical system (MEMS) structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·6 cites·20 claims
- 0481US8921145B2Hybrid MEMS bump design to prevent in-process and in-use stictionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 30, 2014·11 cites·20 claims
- 0579US8368152B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·4 cites·20 claims
- 0678US9355896B2Package systemsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 0777US8338207B2Bulk silicon moving member with dimpleSHU CHIA-PAO·Filed 2011·Granted Dec 25, 2012·4 cites·15 claims
- 0876US8633554B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 21, 2014·3 cites·13 claims
- 0971US8674495B2Package systems having a eutectic bonding material and manufacturing methods thereofSHU CHIA-PAO·Filed 2011·Granted Mar 18, 2014·2 cites·20 claims
- 1068US8723280B2Hybrid MEMS bump design to prevent in-process and in-use stictionSHU CHIA-PAO·Filed 2012·Granted May 13, 2014·2 cites·20 claims
- 1166US9112001B2Package systems and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·1 cites·20 claims
- 1249US8629516B2Bulk silicon moving member with dimpleTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 14, 2014·0 cites·18 claims
- 1343US9000578B2Package systems having an opening in a substrate thereof and manufacturing methods thereofSHU CHIA-PAO·Filed 2010·Granted Apr 7, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →