Inventor · disambiguated record
Chiwan Song
Also filed as: SONG CHIWAN
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0159US2024234276A9Fan-out semiconductor package and method of manufacturing the fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0258US2024258242A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0357US2024321774A1Semiconductor device, method of manufacturing semiconductor device, and semiconductor package including semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →