Inventor · disambiguated record
Christian Stuempfl
Also filed as: STUEMPFL CHRISTIAN
20 granted patents·5 pending applications·280 citations·filing 2002–2019
94Inventor score
Top patents by PatentIndex Score
25 records- 0191US6902951B2Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 7, 2005·67 cites·6 claims
- 0289US7456495B2Semiconductor module with a semiconductor stack, and methods for its productionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 25, 2008·79 cites·19 claims
- 0387US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 0486US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 0582US7944061B2Semiconductor device having through contacts through a plastic housing composition and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 17, 2011·10 cites·10 claims
- 0682US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 0781US9881909B2Method for attaching a semiconductor die to a carrierINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 30, 2018·4 cites·10 claims
- 0878US7714416B2Electronic circuit in a package-in-package configuration and production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 11, 2010·8 cites·19 claims
- 0976US7666777B2Electronic structure with components connected by way of solderable connecting elements and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·7 cites·9 claims
- 1071US10651109B2Selective plating of semiconductor package leadsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·2 cites·24 claims
- 1162US7547645B2Method for coating a structure comprising semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 16, 2009·2 cites·16 claims
- 1257US8330260B2Electronic component of VQFN design and method for producing the sameBAUER MICHAEL·Filed 2007·Granted Dec 11, 2012·1 cites·23 claims
- 1351US9576935B2Method for fabricating a semiconductor package and semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 21, 2017·0 cites·12 claims
- 1451US7749864B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 6, 2010·0 cites·22 claims
- 1550US7294916B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 13, 2007·0 cites·11 claims
- 1649US7834460B2Method for manufacturing an electronic component and corresponding electronic componentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·0 cites·9 claims
- 1748US7662664B2Electronic circuit in a package-on-package configuration and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·0 cites·13 claims
- 1848US7566968B2Biosensor with smart card configurationSIEMENS AG·Filed 2005·Granted Jul 28, 2009·0 cites·10 claims
- 1945US7592236B2Method for applying a structure of joining material to the back surfaces of semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 22, 2009·0 cites·14 claims
- 2045US2005184375A1Electronic device configured as a multichip module, leadframe and panel with leadframe positionsINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2144US2008029865A1Electronic Device and Method For Producing the SameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2242US2008079175A1Layer for chip contact elementBAUER MICHAEL·Filed 2006·Application pending·0 cites
- 2342US2008054451A1Multi-chip assemblyBAUER MICHAEL·Filed 2006·Application pending·0 cites
- 2441US7919857B2Plastic housing and semiconductor component with said plastic housingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 5, 2011·0 cites·16 claims
- 2539US2004043515A1Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housingFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →