Inventor · disambiguated record
Ching-Hou Su
Also filed as: SU CHING-HOU
22 granted patents·1 pending application·70 citations·filing 2011–2024
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17TAIWAN SEMICONDUCTOR MFG2CHIEN TING-YING1CHIU YI HSUN1NI CHYI-TSONG1
Top patents by PatentIndex Score
23 records- 0193US9139423B2Micro electro mechanical system structuresCHIEN TING-YING·Filed 2012·Granted Sep 22, 2015·53 cites·20 claims
- 0286US11488814B2Permeance magnetic assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·1 cites·20 claims
- 0386US2025112032A1Permeance magnetic assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0484US11688633B2Passivation layer for integrated circuit structure and forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0583US12198910B2Permeance magnetic assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0683US9650243B2Method and apparatus for a seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·4 cites·20 claims
- 0781US10361449B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·1 cites·20 claims
- 0879US11695150B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0979US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 1078US12125746B2Passivation layer for integrated circuit structure and forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1178US11854776B2Permeance magnetic assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1275US11101491B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 1369US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 1467US9444398B2Semiconductor structure and fabricating process for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·2 cites·15 claims
- 1566US11069562B1Passivation layer for integrated circuit structure and forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 1663US8741738B2Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloyCHIU YI HSUN·Filed 2011·Granted Jun 3, 2014·2 cites·19 claims
- 1762US10847490B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 1851US10396054B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 1951US9776857B2Methods of fabricating micro electro mechanical system structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·0 cites·20 claims
- 2051US9287188B2Method and apparatus for a seal ring structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·0 cites·19 claims
- 2147US11211301B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 2246US8378490B2Semiconductor apparatus including a metal alloy between a first contact and a second contactTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
- 2341US9368390B2Semiconductor apparatusNI CHYI-TSONG·Filed 2013·Granted Jun 14, 2016·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Ching-Hou Su files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →