Inventor · disambiguated record
Ching-Chung Su
Also filed as: SU CHING-CHUNG
31 granted patents·4 pending applications·56 citations·filing 2007–2024
95Inventor score
Top patents by PatentIndex Score
35 records- 0198US10163974B2Method of forming absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·21 cites·20 claims
- 0296US10847564B1Charge release layer to remove charge carriers from dielectric grid structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·5 cites·20 claims
- 0396US10304898B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·9 cites·20 claims
- 0494US11430909B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·3 cites·20 claims
- 0592US12154939B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·20 claims
- 0692US10804315B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·2 cites·20 claims
- 0786US11990488B2Grid structure with at least partially angled sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·1 cites·20 claims
- 0886US10784150B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·3 cites·20 claims
- 0985US10510799B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·2 cites·20 claims
- 1081US9337225B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·2 cites·19 claims
- 1181US9293392B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
- 1280US12439717B2Grid structure with at least partially angled sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1380US2025160019A1Image sensor and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1479US11948962B2Charge release layer to remove charge carriers from dielectric grid structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1578US2024363791A1Bsi chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1677US2024387613A1Capacitor device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1775US12094997B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 1875US2023387153A1Pixel sensor including a layer stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1974US12468130B2Optical device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 2074US9991303B2Image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 5, 2018·2 cites·19 claims
- 2173US11522004B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 2272US12183753B2Image sensor and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 2372US11380728B2Charge release layer to remove charge carriers from dielectric grid structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 2469US9984918B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·1 cites·17 claims
- 2567US12218160B2Pixel sensor including a layer stack to reduce and/or block the effects of plasma processing and etching on the pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 2667US11769791B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 2763US10840287B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 2859US10361234B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 2959US10276427B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 3055US9941320B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·0 cites·20 claims
- 3152US10163972B2Image sensing device with photon blocking layer and anti-reflective coatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 3250US8987033B2Method for forming CMOS image sensorsSU CHING-CHUNG·Filed 2011·Granted Mar 24, 2015·0 cites·20 claims
- 3347US8049213B2Feature dimension measurementTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·0 cites·9 claims
- 3446US10164156B2Structure and formation method of image sensor structure with grid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·18 claims
- 3544US11164903B2Image sensor with pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →