Inventor · disambiguated record
Ching-Tien Su
Also filed as: SU CHING-TIEN
4 granted patents·2 pending applications·18 citations·filing 2018–2025
71Inventor score
Top patents by PatentIndex Score
6 records- 0194US10522488B1Patterning polymer layer to reduce stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·16 cites·20 claims
- 0290US2025357395A1Semiconductor structure having dielectric plugs penetrating through a polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0382US10964655B2Patterning polymer layer to reduce stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 0479US12469806B2Semiconductor structure having dielectric plugs penetrating through a polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0571US11670609B2Method for manufacturing a semiconductor device including patterning a polymer layer to reduce stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·19 claims
- 0648US2023190680A1Methods and compositions for treating an rna virus induced diseaseGOLDEN BIOTECHNOLOGY CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →