Inventor · disambiguated record
Chih-Yen Su
Also filed as: SU CHIH-YEN
3 granted patents·2 pending applications·0 citations·filing 2019–2024
40Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0151US11694950B2Semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0250US2025017110A1Thermoelectric cooling chip and package structure thereofREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0348US11133291B2Chip package structure with multi-chip stackPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 28, 2021·0 cites·19 claims
- 0447US11362055B2Bump structure of the semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 0536US2020321259A1Semiconductor package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chih-Yen Su files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →