Inventor · disambiguated record
Cheng-Hong Su
Also filed as: SU CHENG-HONG
8 granted patents·3 pending applications·8 citations·filing 2004–2024
77Inventor score
Files withLITE ON TECHNOLOGY CORP5SU CHENG-HONG3SILITEK ELECTRONIC GUANGZHOU2LITE ON OPTO TECH CHANGZHOU CO LTD1
Top patents by PatentIndex Score
11 records- 0186US11774691B2Light emitting module and light-emitting device having the sameLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2021·Granted Oct 3, 2023·2 cites·21 claims
- 0268US12194917B2Light-emitting deviceLITE ON TECHNOLOGY CORP·Filed 2022·Granted Jan 14, 2025·0 cites·7 claims
- 0365US2025143046A1Light emitting diode package structure and lead frame for the sameLITE ON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0463US7815836B2Packaging apparatus for optical-electronic semiconductorsSILITEK ELECTRONIC GUANGZHOU·Filed 2008·Granted Oct 19, 2010·1 cites·15 claims
- 0561US7688599B2Lead frame module for manufacturing light emitting diodesSILITEK ELECTRONIC GUANGZHOU·Filed 2008·Granted Mar 30, 2010·3 cites·15 claims
- 0660US2024162396A1Light-emitting package and light-emitting moduleLITE ON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0753US12422616B2Optoelectronic package structureLITE ON TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 0851US8390102B2Optoisolator leadframe assemblySU CHENG-HONG·Filed 2008·Granted Mar 5, 2013·2 cites·12 claims
- 0938US8853837B2Optoisolator leadframe assemblySU CHENG-HONG·Filed 2013·Granted Oct 7, 2014·0 cites·20 claims
- 1038US2009230421A1Semiconductor package structure, lead frame and conductive assembly for the sameSU CHENG-HONG·Filed 2008·Application pending·0 cites
- 1135US7209226B2Gravity sensorLITE ON TECHNOLOGY CORP·Filed 2004·Granted Apr 24, 2007·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →