Inventor · disambiguated record
Chie Sugama
Also filed as: SUGAMA CHIE
12 granted patents·8 citations·filing 2016–2021
82Inventor score
Top patents by PatentIndex Score
12 records- 0178US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 0273US11462502B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·2 cites·20 claims
- 0373US11370066B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 28, 2022·2 cites·20 claims
- 0466US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 0565US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 0651US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 0744US11890681B2Method for producing bonded object and semiconductor device and copper bonding pasteSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Feb 6, 2024·0 cites·9 claims
- 0842US11483936B2Method for producing joined body, and joining materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·17 claims
- 0942US10748865B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·17 claims
- 1039US11040416B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·8 claims
- 1138US11887960B2Member connection methodHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 30, 2024·0 cites·5 claims
- 1236US11575076B2Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion moduleHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →