Inventor · disambiguated record
Chanon Suwankasab
Also filed as: SUWANKASAB CHANON
9 granted patents·4 pending applications·8 citations·filing 2014–2025
77Inventor score
Top patents by PatentIndex Score
13 records- 0183US10340211B1Sensor module with blade insertNXP BV·Filed 2018·Granted Jul 2, 2019·5 cites·20 claims
- 0276US10790220B2Press-fit semiconductor deviceNXP BV·Filed 2018·Granted Sep 29, 2020·3 cites·20 claims
- 0367US2025266335A1Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2025·Application pending·0 cites
- 0466US12406911B2Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 0557US2025210471A1Semiconductor chip packaging defect free dimple process and deviceNXP BV·Filed 2023·Application pending·0 cites
- 0652US12125771B2Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereofNXP BV·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 0750US11482478B2Shielded electronic package and method of fabricationNXP BV·Filed 2020·Granted Oct 25, 2022·0 cites·16 claims
- 0845US11114239B2Electronic device, device package, and method of fabricationNXP BV·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 0944US11049817B2Semiconductor device with integral EMI shieldNXP BV·Filed 2019·Granted Jun 29, 2021·0 cites·19 claims
- 1042US9721877B1Method of mounting passive electronic component on lead frameNexperia BV·Filed 2016·Granted Aug 1, 2017·0 cites·21 claims
- 1138US9257374B1Thin shrink outline package (TSOP)NXP BV·Filed 2014·Granted Feb 9, 2016·0 cites·8 claims
- 1231US2019229044A1Lead frame with plated lead tipsNXP BV·Filed 2018·Application pending·0 cites
- 1331US2017133342A1Bond Wire ConnectionNXP BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →