Inventor · disambiguated record
Charles Brandon Sweeney
Also filed as: SWEENEY CHARLES B · SWEENEY CHARLES BRANDON
11 granted patents·14 pending applications·30 citations·filing 2014–2023
82Inventor score
Top patents by PatentIndex Score
25 records- 0193US10414147B2Electromagnetic wave-induced localized heating of CNT filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated partsUNIV TEXAS TECH SYSTEM·Filed 2014·Granted Sep 17, 2019·28 cites·10 claims
- 0283US11066303B2Electrochemically expanded materials and reactor and method for producing the sameTEXAS A & M UNIV SYS·Filed 2017·Granted Jul 20, 2021·2 cites·13 claims
- 0370US2022379557A1Atmospheric plasma conduction pathway for the application of electromagnetic energy to 3d printed partsESSENTIUM INC·Filed 2022·Application pending·0 cites
- 0468US11712822B2Microwave-induced localized heating of CNT filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated partUNIV TEXAS TECH SYSTEM·Filed 2019·Granted Aug 1, 2023·0 cites·17 claims
- 0568US11623867B2Electrochemically expanded materials and reactor and method for producing the sameTEXAS A & M UNIV SYS·Filed 2021·Granted Apr 11, 2023·0 cites·21 claims
- 0663US2023415267A1Clad wire feedstock for directed energy deposition additive manufacturingESSENTIUM IPCO LLC·Filed 2023·Application pending·0 cites
- 0760US11446867B2Atmospheric plasma conduction pathway for the application of electromagnetic energy to 3D printed partsESSENTIUM INC·Filed 2018·Granted Sep 20, 2022·0 cites·18 claims
- 0859US2023415238A1Build substrate for directed energy deposition additive manufacturingESSENTIUM IPCO LLC·Filed 2023·Application pending·0 cites
- 0959US2023382041A1Ablative support material for directed energy deposition additive manufacturingESSENTIUM IPCO LLC·Filed 2023·Application pending·0 cites
- 1057US12318997B2Nozzle assembly with a serpentine path for printer head of 3D printerNEXA3D INC·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 1157US12312507B2Radio frequency heating for rapid curing of nanocomposite adhesivesTEXAS A & M UNIV SYS·Filed 2018·Granted May 27, 2025·0 cites·13 claims
- 1257US2023391003A1Contour Smoothing for Material Extrusion Three-Dimensionally Printed PartsESSENTIUM IPCO LLC·Filed 2023·Application pending·0 cites
- 1355US11691351B2High frequency adhesive bondingESSENTIUM INC·Filed 2019·Granted Jul 4, 2023·0 cites·12 claims
- 1454US2024351092A1Wire-straightening apparatus for directed energy deposition additive manufacturingNEXA3D INC·Filed 2022·Application pending·0 cites
- 1552US11376789B2Three dimensional printer apparatusESSENTIUM INC·Filed 2018·Granted Jul 5, 2022·0 cites·17 claims
- 1652US2023173758A1Catalytic Converter System for a Build Chamber of a Three-Dimensional PrinterESSENTIUM INC·Filed 2021·Application pending·0 cites
- 1751US2021053293A1High speed extrusion 3-d printing systemESSENTIUM INC·Filed 2019·Application pending·0 cites
- 1849US11325303B2Three dimensional printer apparatusESSENTIUM INC·Filed 2017·Granted May 10, 2022·0 cites·17 claims
- 1948US2023180764A1Three-dimensionally printable antiviral filamentESSENTIUM IPCO LLC·Filed 2021·Application pending·0 cites
- 2045US2023189424A1Emitter and method for plasma fusing of materialsESSENTIUM IPCO LLC·Filed 2021·Application pending·0 cites
- 2145US2023211526A1Tooling formed from a 3d printed tooling scaffoldESSENTIUM INC·Filed 2021·Application pending·0 cites
- 2245US2023219299A1Adaptive toolpath for producing material extrusion 3d printed mechanical testing specimensESSENTIUM INC·Filed 2021·Application pending·0 cites
- 2345US2020180219A1Systems and Methods for Additive Manufacturing Using Thermally Cross-Linkable MaterialsTEXAS A&M UNIV SYSTEM·Filed 2017·Application pending·0 cites
- 2431US2021370583A1Multiple layer filament and method of manufacturingESSENTIUM INC·Filed 2019·Application pending·0 cites
- 2530US11806256B2Three dimensional print method and partTRIFUSION DEVICES INC·Filed 2018·Granted Nov 7, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →