Inventor · disambiguated record
Chun-Liang Tai
Also filed as: TAI CHUN-LIANG
10 granted patents·2 pending applications·32 citations·filing 2004–2022
83Inventor score
Top patents by PatentIndex Score
12 records- 0194US8431453B2Plasma doping to reduce dielectric loss during removal of dummy layers in a gate structureHUANG YU-LIEN·Filed 2011·Granted Apr 30, 2013·23 cites·20 claims
- 0279US9281307B2Plasma doping to reduce dielectric loss during removal of dummy layers in a gate structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 8, 2016·4 cites·18 claims
- 0374US9406749B2Method of manufacturing a horizontal gate-all-around transistor having a finTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·3 cites·18 claims
- 0472US9176388B2Multi-line width pattern created using photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 3, 2015·2 cites·19 claims
- 0562US10658221B2Semiconductor wafer cleaning apparatus and method for cleaning semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 19, 2020·0 cites·20 claims
- 0660US11823945B2Method for cleaning semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·20 claims
- 0754US12310093B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0852US9733570B2Multi-line width pattern created using photolithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·20 claims
- 0950US9882031B2Method of manufacturing a horizontal gate-all-around transistor having a finTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·20 claims
- 1047US11133200B2Substrate vapor drying apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 28, 2021·0 cites·20 claims
- 1145US2005148079A1Method of detecting oxygen leakageFiled 2004·Application pending·0 cites
- 1244US2008160619A1Method of detecting oxygen leakageTAI CHUN-LIANG·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →