Inventor · disambiguated record
Chi-Hwang Tai
Also filed as: TAI CHI-HWANG
3 granted patents·7 citations·filing 2017–2020
61Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0196US11043482B2Semiconductor component, package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·5 cites·20 claims
- 0278US10319707B2Semiconductor component, package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·2 cites·22 claims
- 0361US10672754B2Semiconductor component, package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →