Inventor · disambiguated record
Chong Un Tan
Also filed as: TAN CHONG UN
7 granted patents·3 pending applications·36 citations·filing 2000–2023
77Inventor score
Files withWESTERN DIGITAL TECH INC6SANDISK SEMICONDUCTOR SHANGHAI CO LTD3SEMICONDUCTOR COMPONENT IND L1
Top patents by PatentIndex Score
10 records- 0177US11195786B1Ball grid array substrateWESTERN DIGITAL TECH INC·Filed 2020·Granted Dec 7, 2021·2 cites·18 claims
- 0275US10418334B2Semiconductor device including corner recessSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·16 claims
- 0374US6864423B2Bump chip lead frame and packageSEMICONDUCTOR COMPONENT IND L·Filed 2000·Granted Mar 8, 2005·31 cites·9 claims
- 0464US10276546B1Semiconductor device with die tilt controlSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Apr 30, 2019·1 cites·16 claims
- 0562US11699685B2Non-cure and cure hybrid film-on-die for embedded controller dieWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 0656US2024162106A1Ball grid array semiconductor device with thermal pads and printed circuit board thereforWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0748US2023137512A1Stacked ssd semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 0846US2023411340A1Semiconductor device including embedded memory dies and method of making sameWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 0944US11798918B2Ball grid array substrateWESTERN DIGITAL TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1042US10128218B2Semiconductor device including die bond pads at a die edgeSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →