Inventor · disambiguated record
Cheng Why Tan
Also filed as: TAN CHENG WHY
14 granted patents·4 pending applications·221 citations·filing 1999–2011
93Inventor score
Files withAVAGO TECH ECBU IP SG PTE LTD4AGILENT TECHNOLOGIES INC3AVAGO TECHNOLOGIES GENERAL IP3APTINA IMAGING CORP1AVAGO TECHNOLOGIES ECBU IP PTE1
Top patents by PatentIndex Score
18 records- 0191US7385178B2Reflective encoders with various emitter-detector configurationsAVAGO TECHNOLOGIES ECBU IP PTE·Filed 2005·Granted Jun 10, 2008·25 cites·17 claims
- 0288US7612386B2High power light emitting diode deviceAVAGO TECH ECBU IP SG PTE LTD·Filed 2006·Granted Nov 3, 2009·19 cites·13 claims
- 0386US6809261B1Physically compact device packageAGILENT TECHNOLOGIES INC·Filed 2003·Granted Oct 26, 2004·52 cites·14 claims
- 0485US7919787B2Semiconductor device with a light emitting semiconductor dieAVAGO TECH ECBU IP SG PTE LTD·Filed 2007·Granted Apr 5, 2011·13 cites·14 claims
- 0585US6806583B2Light sourceAGILENT TECHNOLOGIES INC·Filed 2001·Granted Oct 19, 2004·49 cites·2 claims
- 0670US7745897B2Methods for packaging an image sensor and a packaged image sensorAPTINA IMAGING CORP·Filed 2005·Granted Jun 29, 2010·8 cites·8 claims
- 0764US7102177B2Light-emitting diode incorporating gradient index elementAVAGO TECH ECBU IP SG PTE LTD·Filed 2003·Granted Sep 5, 2006·12 cites·12 claims
- 0863US7495583B2Flat-top reflection-based optical encodersAVAGO TECHNOLOGIES GENERAL IP·Filed 2006·Granted Feb 24, 2009·7 cites·18 claims
- 0957US9123869B2Semiconductor device with a light emitting semiconductor dieLEE KONG WENG·Filed 2011·Granted Sep 1, 2015·1 cites·13 claims
- 1057US7256486B2Packaging device for semiconductor die, semiconductor device incorporating same and method of making sameAVAGO TECH ECBU IP SG PTE LTD·Filed 2003·Granted Aug 14, 2007·8 cites·6 claims
- 1155US7279355B2Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating sameAVAGO TECHNOLOGIES ECBUIP SING·Filed 2003·Granted Oct 9, 2007·7 cites·12 claims
- 1253US6242280B1Method of interconnecting an electronic deviceAGILENT TECHNOLOGIES INC·Filed 1999·Granted Jun 5, 2001·19 cites·10 claims
- 1351US7114939B2Encapsulating brittle substrates using transfer moldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2003·Granted Oct 3, 2006·1 cites·11 claims
- 1445US7490771B2Reflective encoder with interchangable lens on emitter-detector moduleAVAGO TECHNOLOGIES GENERAL IP·Filed 2006·Granted Feb 17, 2009·0 cites·14 claims
- 1537US2005077616A1High power light emitting diode deviceFiled 2003·Application pending·0 cites
- 1636US2004120117A1Electronic package with improved thermal performanceFiled 2002·Application pending·0 cites
- 1736US2004256628A1Optical source having integral diffractive elementFiled 2003·Application pending·0 cites
- 1835US2004217451A1Semiconductor packaging structureLEE SAI-MUN·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →