Inventor · disambiguated record
Christopher D. Thomas
Also filed as: THOMAS CHRISTOPHER · THOMAS CHRISTOPHER D · THOMAS CHRISTOPHER DWANE
14 granted patents·8 pending applications·2,044 citations·filing 1984–2020
94Inventor score
Top patents by PatentIndex Score
22 records- 0197US6605874B2Method of making semiconductor device using an interconnectINTEL CORP·Filed 2001·Granted Aug 12, 2003·359 cites·27 claims
- 0295US5531305ASynchronizer clutch assembly for multiple ratio gearingBORG WARNER AUTOMOTIVE·Filed 1994·Granted Jul 2, 1996·1.4k cites·11 claims
- 0394US7220635B2Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layerINTEL CORP·Filed 2003·Granted May 22, 2007·78 cites·20 claims
- 0493US7153734B2CMOS device with metal and silicide gate electrodes and a method for making itINTEL CORP·Filed 2003·Granted Dec 26, 2006·64 cites·4 claims
- 0593US6696758B2Interconnect structures and a method of electroless introduction of interconnect structuresINTEL CORP·Filed 2002·Granted Feb 24, 2004·57 cites·14 claims
- 0691US6977224B2Method of electroless introduction of interconnect structuresINTEL CORP·Filed 2000·Granted Dec 20, 2005·50 cites·26 claims
- 0779US6843852B2Apparatus and method for electroless spray depositionINTEL CORP·Filed 2002·Granted Jan 18, 2005·20 cites·14 claims
- 0869US7883951B2CMOS device with metal and silicide gate electrodes and a method for making itINTEL CORP·Filed 2006·Granted Feb 8, 2011·3 cites·11 claims
- 0963US4722590AJointing armoured submarine cablesBRITISH TELECOMM·Filed 1984·Granted Feb 2, 1988·18 cites·19 claims
- 1061US7320935B2Semiconductor device using an interconnectINTEL CORP·Filed 2003·Granted Jan 22, 2008·6 cites·17 claims
- 1157US2006006071A1Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditionsCHE GUANGLI·Filed 2005·Application pending·0 cites
- 1256US7001641B2Seed layer treatmentINTEL CORP·Filed 2002·Granted Feb 21, 2006·4 cites·23 claims
- 1351US6733679B2Method of treating an electroless plating wasteINTEL CORP·Filed 2001·Granted May 11, 2004·1 cites·18 claims
- 1447US2004245107A1Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditionsFiled 2003·Application pending·0 cites
- 1546US2005008786A1Apparatus and method for electroless spray depositionFiled 2004·Application pending·0 cites
- 1645US11469955B2Stacked computer network devices having multiple master nodesARRIS ENTPR LLC·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1744US2006045968A1Atomic layer deposition of high quality high-k transition metal and rare earth oxidesMETZ MATTHEW V·Filed 2004·Application pending·0 cites
- 1843US2011147851A1Method For Depositing Gate Metal For CMOS DevicesTHOMAS CHRISTOPHER D·Filed 2009·Application pending·0 cites
- 1943US2005112856A1Seed layer treatmentFiled 2004·Application pending·0 cites
- 2039US11769686B2Methods and apparatus for electroless plating dispenseINTEL CORP·Filed 2016·Granted Sep 26, 2023·0 cites·19 claims
- 2136US2004061197A1Method and apparatus to fabricate an on-chip decoupling capacitorINTEL CORP·Filed 2002·Application pending·0 cites
- 2236US2002064592A1Electroless method of seed layer depostion, repair, and fabrication of Cu interconnectsFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →