Inventor · disambiguated record
Chiung-Yueh Tien
Also filed as: TIEN CHIUNG-YUEH
2 granted patents·2 pending applications·2 citations·filing 2007–2019
38Inventor score
Top patents by PatentIndex Score
4 records- 0169US10696543B1Waterproof MEMS chip package structureLINGSEN PREC INDUSTRIES LTD·Filed 2019·Granted Jun 30, 2020·1 cites·5 claims
- 0258US11041774B2Pressure sensor packageLINGSEN PREC INDUSTRIES LTD·Filed 2018·Granted Jun 22, 2021·1 cites·7 claims
- 0326US2009020500A1Method of forming passage through substrate for mems moduleLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 0421US2009020501A1Method of forming passage in substrate for mems moduleLINGSEN PREC IND·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chiung-Yueh Tien files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →