Inventor · disambiguated record
Chia Sheng Tien
Also filed as: TIEN CHIA SHENG
2 granted patents·0 citations·filing 2021–2021
23Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG2
Top patents by PatentIndex Score
2 records- 0151US12183593B2Manufacturing method for manufacturing a package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
- 0248US11798859B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →