Inventor · disambiguated record
Chung Chieh Ting
Also filed as: TING CHUNG CHIEH
4 granted patents·2 pending applications·2 citations·filing 2018–2024
62Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
Top patents by PatentIndex Score
6 records- 0185US12020952B2Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 0281US11443976B2Trench isolation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0377US2025125186A1Trench isolation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0476US2024304466A1Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0574US12217999B2Trench isolation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0657US11101145B2Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Chung Chieh Ting files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →