Inventor · disambiguated record
Chi-Long Tsai
Also filed as: TSAI CHI LONG
14 granted patents·8 pending applications·151 citations·filing 2003–2024
91Inventor score
Top patents by PatentIndex Score
22 records- 0191US7253519B2Chip packaging structure having redistribution layer with recessADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·57 cites·18 claims
- 0290US7501311B2Fabrication method of a wafer structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 10, 2009·23 cites·15 claims
- 0383US7473998B2Method for forming bump protective collars on a bumped waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·10 cites·6 claims
- 0476US7432188B2Structure of bumps forming on an under metallurgy layer and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 7, 2008·12 cites·9 claims
- 0570US6921716B2Wafer bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 26, 2005·16 cites·21 claims
- 0670US2024355763A1Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0766US7129111B2Method for forming bump protective collars on a bumped waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 31, 2006·12 cites·8 claims
- 0864US12027469B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 2, 2024·0 cites·10 claims
- 0955US7105433B2Method for treating wafer surfaceADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Sep 12, 2006·6 cites·10 claims
- 1055US7015130B2Method for making UBM pads and bumps on waferADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·9 cites·18 claims
- 1151US12183593B2Manufacturing method for manufacturing a package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
- 1249US2007252275A1Chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1348US11798859B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·15 claims
- 1448US2005016859A1[process for fabricating bumps]Filed 2004·Application pending·0 cites
- 1545US7261828B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 28, 2007·2 cites·17 claims
- 1642US7041590B2Formation method for conductive bumpADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·4 cites·20 claims
- 1740US2007218675A1Method for manufacturing bump of wafer level packageTSAI CHI-LONG·Filed 2006·Application pending·0 cites
- 1838US2004256737A1[flip-chip package substrate and flip-chip bonding process thereof]Filed 2004·Application pending·0 cites
- 1938US2005017376A1IC chip with improved pillar bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2038US2004183195A1[under bump metallurgy layer]Filed 2004·Application pending·0 cites
- 2133US2007134905A1Method for mounting bumps on an under metallurgy layerTSAI CHI-LONG·Filed 2006·Application pending·0 cites
- 2232US7402510B2Etchant and method for forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 22, 2008·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →