Inventor · disambiguated record
Chung-Hao Tsai
Also filed as: TSAI CHUNG-HAO
112 granted patents·36 pending applications·426 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD134WU TZONG-LIN7TAIWAN SEMICONDUCTOR MFG4POWERTECH TECHNOLOGY INC1SUNONWEALTH ELECTRIC MACHINE IND CO LTD1
Top patents by PatentIndex Score
148 records- 0199US11587916B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·8 cites·20 claims
- 0299US10504835B1Package structure, semiconductor chip and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·64 cites·20 claims
- 0398US11769731B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·4 cites·20 claims
- 0498US11456251B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0598US11362077B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 14, 2022·4 cites·20 claims
- 0698US11282816B2Memory packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·6 cites·20 claims
- 0798US11244939B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 0898US10157834B1Electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0998US10153239B2Antennas and waveguides in InFO structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·59 cites·20 claims
- 1097US12327796B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 10, 2025·2 cites·20 claims
- 1197US11855046B2Memory packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·3 cites·20 claims
- 1297US11841541B2Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 12, 2023·5 cites·20 claims
- 1397US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 1497US11302649B2Semiconductor device with shielding structure for cross-talk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·6 cites·20 claims
- 1597US11211360B2Passive device module, semiconductor package including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·8 cites·20 claims
- 1696US11488909B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·4 cites·20 claims
- 1796US10867938B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·16 cites·20 claims
- 1895US11637097B2Method of manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 25, 2023·2 cites·20 claims
- 1995US11450628B2Package structure including a solenoid inductor laterally aside a die and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 2095US10796990B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·9 cites·20 claims
- 2194US12094860B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 2294US12021047B2Semiconductor packages having a die, an encapsulant, and a redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 2394US11923315B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 2494US11424197B2Package, package structure with redistributing circuits and antenna elements and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·8 cites·20 claims
- 2594US11315891B2Methods of forming semiconductor packages having a die with an encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 26, 2022·11 cites·20 claims
- 2694US10134708B2Package with thinned substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·9 cites·20 claims
- 2794US8339212B2Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signalWU TZONG-LIN·Filed 2010·Granted Dec 25, 2012·16 cites·19 claims
- 2893US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 2993US9735118B2Antennas and waveguides in InFO structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 3093US9252491B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 2, 2016·11 cites·20 claims
- 3191US11482788B2Antenna device and method for manufacturing antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·20 claims
- 3291US10962711B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·4 cites·20 claims
- 3391US10763164B2Package structure with inductor and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·7 cites·20 claims
- 3490US10734323B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·5 cites·20 claims
- 3589US10770795B2Antenna device and method for manufacturing antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 8, 2020·5 cites·20 claims
- 3688US10879183B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·5 cites·19 claims
- 3787US12033963B2Package structure comprising thermally conductive layer around the IC dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·20 claims
- 3887US11495573B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 3987US10930628B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 4087US10818640B1Die stacks and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 4186US12100698B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 4286US10163824B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·4 cites·15 claims
- 4386US2025349819A1Method and structure for 3dic power distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4485US11854928B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 4585US11410923B2Semiconductor device, integrated fan-out package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·4 cites·20 claims
- 4685US11380655B2Die stacks and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
- 4785US2025067926A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4884US12489062B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 4984US10270172B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
- 5084US9537205B23D antenna for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·6 cites·19 claims
Showing the top 50 of 148 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →