Inventor · disambiguated record
Chang Chin Tsai
Also filed as: TSAI CHANG-CHIN
8 granted patents·4 pending applications·4 citations·filing 2016–2024
75Inventor score
Top patents by PatentIndex Score
12 records- 0178US11081413B2Semiconductor package with inner and outer cavitiesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 0275US12094995B2Optical device including lid having first and second cavity with inclined sidewallsADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 17, 2024·0 cites·13 claims
- 0370US2024170603A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0468US10770624B2Semiconductor device package, optical package, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 0563US11888081B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 30, 2024·0 cites·14 claims
- 0659US2025157863A1Power moduleDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0758US2025149347A1Method for fabricating semiconductor packaging structure and semiconductor packaging structure fabricated using the sameDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0858US2024429143A1Power module structureDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0957US11430906B2Optical device including lid having first and second cavity with inclined sidewallsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 30, 2022·0 cites·17 claims
- 1057US11410915B2Semiconductor package structure including an encapsulant having a cavity exposing an interposerADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 1151US11551963B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 1246US10453760B2Lid array panel, package with lid and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 22, 2019·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →