Inventor · disambiguated record
Chen-Fong Tsai
Also filed as: TSAI CHEN-FONG
17 granted patents·24 pending applications·9 citations·filing 2020–2025
88Inventor score
Top patents by PatentIndex Score
41 records- 0196US11908708B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·3 cites·20 claims
- 0294US11855040B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0391US12132079B2Bonding and isolation techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 0489US11901189B2Ambient controlled two-step thermal treatment for spin-on coating layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·2 cites·20 claims
- 0586US2025364407A1Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0685US11990404B2Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·1 cites·20 claims
- 0783US12347696B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0881US12327811B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0980US2025293052A1Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US2025359312A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1179US2025273624A1Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1277US2025349818A1Bonding techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1377US2025324687A1Channel regions in stacked transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1476US2024266285A1Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1575US2025323206A1Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1675US2024387232A1Bonding system and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1774US2024379616A1Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1874US2024387188A1Ambient controlled two-step thermal treatment for spin-on coating layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1974US2024387451A1Wafer Bonding Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2074US2024387445A1Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2173US2024379748A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2271US12087592B2Ambient controlled two-step thermal treatment for spin-on coating layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 2370US12266574B2Flowable chemical vapor deposition (FCVD) using multi-step anneal treatment and devices thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 2470US12249592B2Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 2570US12230532B2Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 2670US2025089313A1Channel regions in stacked transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2770US2024321855A1Bonding techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2870US2024332401A1Method of forming a nano-fet semiconductor deviceTAWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2969US2025204019A1Flowable chemical vapor deposition (fcvd) using multi-step anneal treatment and devices thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3067US12237211B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 3167US2024321883A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3266US12255171B2Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 3366US12040382B2Method of forming a nano-FET semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 3465US12438031B2Bonding system and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 3565US12211820B2Wafer bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 3665US2025149378A1Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3764US12368129B2Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 3860US2023163198A1Nano-fet semiconductor device and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3958US2024282815A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4055US2025006687A1Heat dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4151US2024055480A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →