Inventor · disambiguated record
Chih-Yu Tsai
Also filed as: TSAI CHIH-YU
12 granted patents·8 pending applications·27 citations·filing 2003–2023
84Inventor score
Files withREALTEK SEMICONDUCTOR CORP6HUAWEI TECH CO LTD5IND TECH RES INST3ACER INC1UNIV NAT CENTRAL1
Top patents by PatentIndex Score
20 records- 0195US10263336B1Multi-band multi-antenna arrayIND TECH RES INST·Filed 2017·Granted Apr 16, 2019·17 cites·15 claims
- 0288US10367266B2Multi-antenna communication deviceIND TECH RES INST·Filed 2016·Granted Jul 30, 2019·7 cites·19 claims
- 0386US9729121B2LC tank capable of reducing electromagnetic radiation by itself and manufacturing method thereofREALTEK SEMICONDUCTOR CORP·Filed 2015·Granted Aug 8, 2017·3 cites·17 claims
- 0471US11699550B2Inductor structureREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Jul 11, 2023·0 cites·12 claims
- 0562US2025138188A1Unmanned vehicle processing system and unmanned vehicle processing methodIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0659US10867746B2Inductor structureREALTEK SEMICONDUCTOR CORP·Filed 2016·Granted Dec 15, 2020·0 cites·12 claims
- 0758US12489212B2Electronic deviceHUAWEI TECH CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0856US12170402B2Electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 0954US11616012B2Patterned shielding structureREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Mar 28, 2023·0 cites·19 claims
- 1051US9644812B2High-contrast miniature headlampUNIV NAT CENTRAL·Filed 2014·Granted May 9, 2017·0 cites·8 claims
- 1150US12095158B2Electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·18 claims
- 1250US11916282B2Coupling antenna apparatus and electronic deviceHUAWEI TECH CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·20 claims
- 1348US2025087906A1Antenna-in-module - antenna-in-package, chip, and electronic deviceHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1440US10074587B2Bonding wire-type heat sink structure for semiconductor devicesREALTEK SEMICONDUCTOR CORP·Filed 2017·Granted Sep 11, 2018·0 cites·10 claims
- 1534US2017104261A1Communication deviceACER INC·Filed 2015·Application pending·0 cites
- 1632US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 1732US2003160316A1Open-type multichips stack packagingFiled 2003·Application pending·0 cites
- 1831US2016260537A1Transformer based lctank structureREALTEK SEMICONDUCTOR CORP·Filed 2015·Application pending·0 cites
- 1931US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 2030US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →