Inventor · disambiguated record
Chen-Jung Tsai
Also filed as: TSAI CHEN-JUNG
24 granted patents·20 pending applications·360 citations·filing 2001–2011
96Inventor score
Files withMACRONIX INT CO LTD20HK APPLIED SCIENCE & TECH RES13ZHANG WEI2CHAN YICK CHUEN1CHEN SHOU-LUNG1
Top patents by PatentIndex Score
44 records- 0195US8044899B2Methods and apparatus for backlight calibrationHK APPLIED SCIENCE & TECH RES·Filed 2007·Granted Oct 25, 2011·76 cites·21 claims
- 0292US7521783B2Ultra thin image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Apr 21, 2009·21 cites·10 claims
- 0391US8207931B2Method of displaying a low dynamic range image in a high dynamic rangeZHANG WEI·Filed 2007·Granted Jun 26, 2012·12 cites·20 claims
- 0491US7217995B2Apparatus for stacking electrical components using insulated and interconnecting viaMACRONIX INT CO LTD·Filed 2005·Granted May 15, 2007·20 cites·22 claims
- 0590US7227253B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Jun 5, 2007·16 cites·15 claims
- 0688US6650008B2Stacked semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Nov 18, 2003·54 cites·25 claims
- 0787US6559526B2Multiple-step inner lead of leadframeMACRONIX INT CO LTD·Filed 2001·Granted May 6, 2003·52 cites·14 claims
- 0881US7828472B2Light guiding strip and backlight module and display using the sameHK APPLIED SCIENCE & TECH RES·Filed 2007·Granted Nov 9, 2010·13 cites·16 claims
- 0979US8228272B2Backlight device and liquid crystal display incorporating the backlight devicePENG HUAJUN·Filed 2007·Granted Jul 24, 2012·5 cites·24 claims
- 1076US6972372B1Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnectionMACRONIX INT CO LTD·Filed 2004·Granted Dec 6, 2005·23 cites·21 claims
- 1174US7495327B2Chip stacking structureMACRONIX INT CO LTD·Filed 2006·Granted Feb 24, 2009·5 cites·19 claims
- 1274US7045888B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2004·Granted May 16, 2006·16 cites·7 claims
- 1372US7259042B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Aug 21, 2007·4 cites·13 claims
- 1471US7122904B2Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2002·Granted Oct 17, 2006·16 cites·4 claims
- 1570US7841739B2Total internal reflection side emitting coupling deviceHK APPLIED SCIENCE & TECH RES·Filed 2007·Granted Nov 30, 2010·8 cites·22 claims
- 1663US7102159B2Ultra thin image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2004·Granted Sep 5, 2006·8 cites·13 claims
- 1758US7462925B2Method and apparatus for stacking electrical components using via to provide interconnectionMACRONIX INT CO LTD·Filed 2004·Granted Dec 9, 2008·6 cites·40 claims
- 1857US8243007B2Image display device and methodZHANG WEI·Filed 2008·Granted Aug 14, 2012·0 cites·21 claims
- 1954US7755188B2Method and apparatus for stacking electrical components using via to provide interconnectionMACRONIX INT CO LTD·Filed 2008·Granted Jul 13, 2010·0 cites·4 claims
- 2051US7892888B2Method and apparatus for stacking electrical components using via to provide interconnectionMACRONIX INT CO LTD·Filed 2007·Granted Feb 22, 2011·0 cites·7 claims
- 2150US6977436B2Semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Dec 20, 2005·4 cites·23 claims
- 2250US2009167670A1Method of determining luminance values for a backlight of an lcd panel displaying an imageHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 2349US2008150881A1Flat panel display and driving method thereofHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 2449US2008122832A1Image display apparatusHK APPLIED SCIENCE & TECH RES·Filed 2006·Application pending·0 cites
- 2548US8558357B2Ultra thin image sensor package structure and method for fabricationTSAI CHEN JUNG·Filed 2009·Granted Oct 15, 2013·0 cites·19 claims
- 2648US2009122001A1Method and apparatus for image display with backlight illuminationHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 2748US2010277436A1Sensing System for a Touch Sensitive DeviceHK APPLIED SCIENCE & TECH RES·Filed 2009·Application pending·0 cites
- 2848US2008186272A1Backlit Display and Backlight System ThereofHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 2948US2009051642A1Backlight assembly, method of driving the same and display system having the same thereofHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 3047US2007018333A1Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2006·Application pending·0 cites
- 3147US2008238336A1Back-Light Devices and Displays Incorporating SameHK APPLIED SCIENCE & TECH RES·Filed 2007·Application pending·0 cites
- 3246US2008186734A1Side-emitting backlight system and backlit display using the sameKONG KONG APPLIED SCIENCE AND·Filed 2007·Application pending·0 cites
- 3345US2008164823A1Method and light emitting diode backlight system with adjustable color gamutHK APPLIED SCIENCE & TECH RES·Filed 2008·Application pending·0 cites
- 3444US7291927B2Dual chips stacked packaging structureMACRONIX INT CO LTD·Filed 2003·Granted Nov 6, 2007·1 cites·23 claims
- 3543US2010170725A1Touch surface and system and method of detecting touch inputHK APPLIED SCIENCE & TECH RES·Filed 2009·Application pending·0 cites
- 3643US2008198235A1High dynamic range image recorderCHEN SHOU-LUNG·Filed 2007·Application pending·0 cites
- 3741US2007052079A1Multi-chip stacking package structureMACRONIX INT CO LTD·Filed 2005·Application pending·0 cites
- 3838US2005012184A1Semiconductor packaging structureFiled 2004·Application pending·0 cites
- 3938US2002180021A1Three-dimension multi-chip stack package technologyMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 4037US2002180020A1Three-dimension multi-chip stack package technologyFiled 2001·Application pending·0 cites
- 4136US2004021230A1Ultra thin stacking packaging deviceMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 4236US2004000703A1Semiconductor package body having a lead frame with enhanced heat dissipationFiled 2002·Application pending·0 cites
- 4335US7607792B2Light-emitting devices and lens thereforHONG KONG APPLIEED SCIENCE AND·Filed 2006·Granted Oct 27, 2009·0 cites·19 claims
- 4433US2012206784A1Device for reducing speckle effect in a display systemCHAN YICK CHUEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →