Inventor · disambiguated record
Chen-Wen Tsai
Also filed as: TSAI CHEN-WEN
10 granted patents·2 pending applications·246 citations·filing 1992–2005
91Inventor score
Top patents by PatentIndex Score
12 records- 0195US6395996B1Multi-layered substrate with a built-in capacitor designSILICON INTEGRATED SYS CORP·Filed 2000·Granted May 28, 2002·104 cites·1 claims
- 0282US6116427ATray for ball grid array devicesSILICON INTEGRATED SYS CORP·Filed 2000·Granted Sep 12, 2000·30 cites·7 claims
- 0373US6524942B2Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 2002·Granted Feb 25, 2003·17 cites·10 claims
- 0472US6653574B2Multi-layered substrate with a built-in capacitor design and a method of making the sameSILICON INTEGRATED SYS CORP·Filed 2001·Granted Nov 25, 2003·17 cites·3 claims
- 0572US6509646B1Apparatus for reducing an electrical noise inside a ball grid array packageSILICON INTEGRATED SYS CORP·Filed 2000·Granted Jan 21, 2003·18 cites·7 claims
- 0670US5219802APorous ceramic radiation plateIND TECH RES INST·Filed 1992·Granted Jun 15, 1993·23 cites·11 claims
- 0759US6365970B1Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 1999·Granted Apr 2, 2002·21 cites·18 claims
- 0857US6423577B1Method for reducing an electrical noise inside a ball grid array packageSILICON INTEGRATED SYS CORP·Filed 2000·Granted Jul 23, 2002·10 cites·11 claims
- 0952US6498505B2Jigs for semiconductor componentsSILICON INTEGRATED SYS CORP·Filed 2001·Granted Dec 24, 2002·6 cites·5 claims
- 1037US6838756B2Chip-packaging substrateSILICON INTEGRATED SYS CORP·Filed 2002·Granted Jan 4, 2005·0 cites·20 claims
- 1136US2006273441A1Assembly structure and method for chip scale packageCHUNG YUEH-CHIU·Filed 2005·Application pending·0 cites
- 1231US2002163073A1Multi-layer substrate for an IC chipFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →