Inventor · disambiguated record
Chih-Chiang Tsao
Also filed as: TSAO CHIH-CHIANG
35 granted patents·18 pending applications·52 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
53 records- 0196US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 0295US11862577B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0395US10276536B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·8 cites·20 claims
- 0492US11211341B2Package structure and method of fabrcating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·6 cites·20 claims
- 0591US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 0685US12489030B2Methods of manufacturing integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 0785US11585992B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 0885US11002927B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·3 cites·20 claims
- 0984US12230597B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 1083US2025336786A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1182US11482491B2Package structure with porous conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 25, 2022·3 cites·10 claims
- 1282US10978370B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1382US2025316500A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1481US11791192B2Workpiece holder, wafer chuck, wafer holding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 17, 2023·1 cites·18 claims
- 1581US10535644B1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 1681US9978716B2Package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 1781US9536865B1Interconnection joints having variable volumes in package structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 1881US2024274589A1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1980US2025157974A1Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2078US12417927B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2178US11874513B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 2278US2025349751A1Integrated circuit device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2377US12266559B2Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpieceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2477US11996400B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2577US2025343128A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676US11721659B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 2774US2024371813A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2874US2024389240A1Materials for semiconductor package mount applications and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2974US2025201621A1Workpiece holder, wafer chuck, wafer holding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3073US11901258B2Iintegrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 3173US11049832B2Formation method of package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 3273US2024332215A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3370US12107064B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 3470US11342321B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 3569US2022359356A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3669US2024387346A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3767US12512451B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 3867US12261088B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·20 claims
- 3967US11830781B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 4067US11830746B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 4167US2024107682A1Materials for semiconductor package mount applications and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4267US2025201640A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4367US2024071952A1Integrated circuit device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4466US10658323B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 4565US12051655B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 4662US11664300B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 30, 2023·0 cites·20 claims
- 4761US2025372491A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4859US12051639B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·20 claims
- 4956US2024312941A1Electronic apparatus and method for forming conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5050US11374303B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →