Inventor · disambiguated record
Chang-Chen Tsao
Also filed as: TSAO CHANG-CHEN
7 granted patents·1 pending application·17 citations·filing 2017–2024
80Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0193US10569520B2Wafer debonding system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·7 cites·20 claims
- 0290US10155369B2Wafer debonding system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·7 claims
- 0388US10889097B2Wafer debonding system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 12, 2021·3 cites·20 claims
- 0484US11670524B2Fully automated wafer debonding system and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0584US2025118587A1Simultaneous bonding approach for high quality wafer stacking applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0681US12211727B2Simultaneous bonding approach for high quality wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0774US11621186B2Simultaneous bonding approach for high quality wafer stacking applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 0864US11094575B2Simultaneous bonding approach for high quality wafer stacking applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →