Inventor · disambiguated record
Christine H. Tsau
Also filed as: TSAU CHRISTINE · TSAU CHRISTINE H
14 granted patents·3 pending applications·40 citations·filing 2006–2024
89Inventor score
Top patents by PatentIndex Score
17 records- 0189US7943411B2Apparatus and method of wafer bonding using compatible alloyANALOG DEVICES INC·Filed 2009·Granted May 17, 2011·12 cites·6 claims
- 0284US8507306B2Reduced stiction MEMS device with exposed silicon carbideCHEN LI·Filed 2010·Granted Aug 13, 2013·6 cites·19 claims
- 0382US7981765B2Substrate bonding with bonding material having rare earth metalANALOG DEVICES INC·Filed 2009·Granted Jul 19, 2011·7 cites·8 claims
- 0481US8288191B2Apparatus and method of wafer bonding using compatible alloyMARTIN JOHN R·Filed 2011·Granted Oct 16, 2012·4 cites·15 claims
- 0575US8507913B2Method of bonding wafersNUNAN THOMAS KIERAN·Filed 2010·Granted Aug 13, 2013·4 cites·20 claims
- 0668US9102512B2Sealed MEMS devices with multiple chamber pressuresANALOG DEVICES INC·Filed 2013·Granted Aug 11, 2015·2 cites·20 claims
- 0767US7776734B2Barrier layer for fine-pitch mask-based substrate bumpingINTEL CORP·Filed 2006·Granted Aug 17, 2010·3 cites·12 claims
- 0864US7638877B2Alternative to desmear for build-up roughening and copper adhesion promotionINTEL CORP·Filed 2006·Granted Dec 29, 2009·2 cites·15 claims
- 0957US2024300808A1Mems stress isolation technology with backside etched isolation trenchesANALOG DEVICES INC·Filed 2024·Application pending·0 cites
- 1053US8268724B2Alternative to desmear for build-up roughening and copper adhesion promotionJOMAA HOUSSAM·Filed 2009·Granted Sep 18, 2012·0 cites·9 claims
- 1152US8304861B2Substrate bonding with bonding material having rare earth metalMARTIN JOHN R·Filed 2011·Granted Nov 6, 2012·0 cites·22 claims
- 1252US8293582B2Method of substrate bonding with bonding material having rare Earth metalMARTIN JOHN R·Filed 2011·Granted Oct 23, 2012·0 cites·19 claims
- 1348US8183692B2Barrier layer for fine-pitch mask-based substrate bumpingNALLA RAVI K·Filed 2010·Granted May 22, 2012·0 cites·7 claims
- 1446US9105644B2Apparatus and method for forming alignment features for back side processing of a waferANALOG DEVICES INC·Filed 2013·Granted Aug 11, 2015·0 cites·10 claims
- 1543US8956904B2Apparatus and method of wafer bonding using compatible alloyANALOG DEVICES INC·Filed 2012·Granted Feb 17, 2015·0 cites·15 claims
- 1641US2013288070A1Method for Creating Asperities in Metal for Metal-to-Metal BondingANALOG DEVICES INC·Filed 2013·Application pending·0 cites
- 1736US2010320548A1Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device FabricationANALOG DEVICES INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →