Inventor · disambiguated record
Chun-Hao Tseng
Also filed as: TSENG CHUN · TSENG CHUN-HAO
55 granted patents·6 pending applications·142 citations·filing 2008–2021
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34HTC CORP8TSENG CHUN HAO4IND TECH RES INST3TAIWAN SEMICONDUCTOR MFG3
Top patents by PatentIndex Score
61 records- 0195US9036956B2Method of fabricating a polymer waveguideTSENG CHUN-HAO·Filed 2012·Granted May 19, 2015·31 cites·20 claims
- 0294US11658044B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0394US9835940B2Method to fabricate mask-pellicle systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 5, 2017·5 cites·20 claims
- 0492US9576930B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·10 cites·19 claims
- 0590US10143383B2Attachable monitoring deviceTSENG CHUN HAO·Filed 2015·Granted Dec 4, 2018·41 cites·18 claims
- 0689US9419156B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·6 cites·18 claims
- 0786US10177082B2Method for forming semiconductor package using carbon nano material in molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·3 cites·20 claims
- 0885US9244223B2Light coupling formation in a waveguide layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·3 cites·20 claims
- 0984US10276471B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 1084US9478475B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·3 cites·20 claims
- 1182US10748825B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 1282US9488779B2Apparatus and method of forming laser chip package with waveguide for light couplingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·4 cites·20 claims
- 1382US8922900B2Optical element structure and optical element fabricating process for the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 30, 2014·5 cites·20 claims
- 1480US9910217B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 6, 2018·2 cites·20 claims
- 1580US9099623B2Manufacture including substrate and package structure of optical chipTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·3 cites·21 claims
- 1678US9960099B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 1, 2018·4 cites·20 claims
- 1777US10440841B2Electronic deviceHTC CORP·Filed 2018·Granted Oct 8, 2019·1 cites·16 claims
- 1876US10408998B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 10, 2019·1 cites·20 claims
- 1975US10510707B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 2073US11574886B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 2173US10539751B2Optical bench on substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 21, 2020·1 cites·20 claims
- 2270US10180547B2Optical bench on substrateLEE WAN YU·Filed 2012·Granted Jan 15, 2019·3 cites·20 claims
- 2370US9902092B2Vacuum carrier module, method of using and process of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 27, 2018·2 cites·19 claims
- 2470US9568677B2Waveguide structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·2 cites·20 claims
- 2569US9490148B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Nov 8, 2016·2 cites·20 claims
- 2666US11125940B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2765US11088058B2Method for forming semiconductor package using carbon nano material in molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 2865US10861817B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 2964US10957559B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 3064US10784227B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 3162US10490492B2Method for forming semiconductor package using carbon nano material in molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 3261US10859908B2Method to fabricate mask-pellicle systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 8, 2020·0 cites·20 claims
- 3360US10983278B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 3460US10387708B2Physiological characteristic identifying moduleHTC CORP·Filed 2019·Granted Aug 20, 2019·0 cites·5 claims
- 3558US10135224B2Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 3658US9865481B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 3758US9000416B2Nanoparticle synthesisMASSACHUSETTS INST TECHNOLOGY·Filed 2013·Granted Apr 7, 2015·0 cites·12 claims
- 3857US10541154B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 21, 2020·0 cites·20 claims
- 3957US9859199B2Method for forming semiconductor package using carbon nano material in molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 2, 2018·0 cites·20 claims
- 4057US9799528B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·0 cites·20 claims
- 4156US10082626B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·0 cites·20 claims
- 4256US9831634B2Apparatus and method of forming chip package with waveguide for light couplingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·20 claims
- 4355US10137603B2Vacuum carrier module, method of using and process of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·20 claims
- 4455US9946306B2Electronic assembly and assemblying methodHTC CORP·Filed 2014·Granted Apr 17, 2018·1 cites·8 claims
- 4554US8389393B2Nanoparticle synthesisGRADE HACEK OVER C AK SILVIJA·Filed 2009·Granted Mar 5, 2013·1 cites·16 claims
- 4653US10275631B2Electronic device and physiological characteristic identifying moduleHTC CORP·Filed 2015·Granted Apr 30, 2019·0 cites·5 claims
- 4752US10434196B2Multivalent saccharide complex, radioactive multivalent saccharide complex contrast agent, and use thereofINER AEC EXECUTIVE YUAN·Filed 2018·Granted Oct 8, 2019·0 cites·9 claims
- 4852US9374515B2Electronic element supporting base and electronic deviceHTC CORP·Filed 2014·Granted Jun 21, 2016·0 cites·15 claims
- 4951US8043462B2Methods for forming gas barriers on electronic devicesIND TECH RES INST·Filed 2009·Granted Oct 25, 2011·0 cites·25 claims
- 5050US11179040B2Attachable monitoring deviceIWEECARE CO LTD·Filed 2018·Granted Nov 23, 2021·0 cites·11 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →