Inventor · disambiguated record

Cheng Lan Tseng

Also filed as: TSENG CHENG LAN

1 granted patent·1 pending application·2 citations·filing 2009–2010

19Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG2

Top patents by PatentIndex Score

2 records

0160US8357998B2Wirebonded semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 22, 2013·2 cites·20 claims
0241US2010200981A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Cheng Lan Tseng files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →