Inventor · disambiguated record
Chun-Chin Tu
Also filed as: TU CHUN-CHIN
6 granted patents·5 pending applications·1 citations·filing 2020–2024
68Inventor score
Files withGLOBALWAFERS CO LTD11
Top patents by PatentIndex Score
11 records- 0183US12252806B2Systems and methods for a preheat ring in a semiconductor wafer reactorGLOBALWAFERS CO LTD·Filed 2020·Granted Mar 18, 2025·1 cites·13 claims
- 0278US12503792B2Methods for manufacturing a semiconductor wafer using a preheat ring in a wafer reactorGLOBALWAFERS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·19 claims
- 0375US2025129512A1Methods for determining suitability of czochralski growth conditions for producing substrates for epitaxyGLOBALWAFERS CO LTD·Filed 2024·Application pending·0 cites
- 0474US2024401201A1Window for chemical vapor deposition systems and related methodsGLOBALWAFERS CO LTD·Filed 2024·Application pending·0 cites
- 0569US2025011968A1Methods for determining suitability of silicon substrates for epitaxyGLOBALWAFERS CO LTD·Filed 2024·Application pending·0 cites
- 0665US12482662B2Systems and methods for producing epitaxial wafersGLOBALWAFERS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0765US12227874B2Methods for determining suitability of Czochralski growth conditions for producing substrates for epitaxyGLOBALWAFERS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·12 claims
- 0864US12084770B2Window for chemical vapor deposition systems and related methodsGLOBALWAFERS CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·19 claims
- 0962US12152314B2Methods for determining suitability of silicon substrates for epitaxyGLOBALWAFERS CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·11 claims
- 1061US2023354478A1Methods for semiconductor wafer processing using a radiant heat cap in a semiconductor wafer reactorGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 1151US2024006225A1Susceptor for epitaxial processing and epitaxial reactor including the susceptorGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →