Inventor · disambiguated record
Chun-Kai Tzeng
Also filed as: TZENG CHUN-KAI
17 granted patents·7 pending applications·33 citations·filing 2007–2025
90Inventor score
Top patents by PatentIndex Score
24 records- 0198US11163335B1Portable information handling system having a bendable integrated displayDELL PRODUCTS LP·Filed 2020·Granted Nov 2, 2021·11 cites·16 claims
- 0296US11532692B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·4 cites·20 claims
- 0389US11842003B1Integrated force sensing method for haptic functionDELL PRODUCTS LP·Filed 2022·Granted Dec 12, 2023·2 cites·20 claims
- 0485US11720177B1Coaxial independent haptic force sensing unitDELL PRODUCTS LP·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0584US12279370B2Hybrid through hole for solid state intrusion detectionDELL PRODUCTS LP·Filed 2022·Granted Apr 15, 2025·1 cites·16 claims
- 0684US11573645B1Touchpad module of an information handling systemDELL PRODUCTS LP·Filed 2022·Granted Feb 7, 2023·1 cites·14 claims
- 0783US10910466B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·20 claims
- 0883US2024371915A1Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0980US12136644B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 1077US9817493B2Clickpad and information handling system including sameDELL PRODUCTS LP·Filed 2015·Granted Nov 14, 2017·3 cites·20 claims
- 1175US7684188B2Media base security device and method of useDELL PRODUCTS LP·Filed 2007·Granted Mar 23, 2010·8 cites·18 claims
- 1270US11669198B1Touchpad assembly for an information handling systemDELL PRODUCTS LP·Filed 2022·Granted Jun 6, 2023·0 cites·11 claims
- 1368US11592930B1Touchpad assembly for an information handling systemDELL PRODUCTS LP·Filed 2022·Granted Feb 28, 2023·0 cites·20 claims
- 1462US12230595B2Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 1560US12408251B2Keyboard backlight controlDELL PRODUCTS LP·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1660US2025081730A1Display with Vertically Stacked ComponentsAPPLE INC·Filed 2024·Application pending·0 cites
- 1757US11024593B2Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·18 claims
- 1851US12158178B2Systems and methods for universal clamping of information handling resourceDELL PRODUCTS LP·Filed 2020·Granted Dec 3, 2024·0 cites·14 claims
- 1950US2025244803A1Carrier module to provide a thermal solution for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 2050US2025247983A1Carrier module for grounding stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 2150US2025244802A1Carrier module for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 2249US2024340565A1Speaker module for an information handling systemDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 2347US2025149485A1Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2446US11171085B2Semiconductor device structure with magnetic layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 9, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →