Inventor · disambiguated record
Chung-Hsing Tzu
Also filed as: TZU CHUNG HSING
14 granted patents·21 pending applications·354 citations·filing 1998–2020
92Inventor score
Files withTZU CHUNG-HSING11DOMINTECH CO LTD6GREAT TEAM BACKEND FOUNDRY INC6SAMPO SEMICONDUCTOR CORP4LITE ON SEMICONDUCTOR CORP2
Top patents by PatentIndex Score
35 records- 0194US7187064B2Electrical-interference-isolated transistor structureDOMINTECH CO LTD·Filed 2005·Granted Mar 6, 2007·77 cites·12 claims
- 0291US6201302B1Semiconductor package having multi-diesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Mar 13, 2001·155 cites·18 claims
- 0380US6963141B2Semiconductor package for efficient heat spreadingLEE JUNG-YU·Filed 2000·Granted Nov 8, 2005·49 cites·11 claims
- 0473US9472493B1High heat-dissipation chip package structureTZU CHUNG HSING·Filed 2015·Granted Oct 18, 2016·3 cites·9 claims
- 0566US7859123B2Wire bonding structure and manufacturing method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Granted Dec 28, 2010·4 cites·5 claims
- 0666US7119420B2Chip packaging structure adapted to reduce electromagnetic interferenceDOMINTECH CO LTD·Filed 2005·Granted Oct 10, 2006·4 cites·6 claims
- 0758US5973407AIntegral heat spreader for semiconductor packageSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Oct 26, 1999·28 cites·2 claims
- 0857US7274098B2Chip packaging structure without leadframeDOMINTECH CO LTD·Filed 2005·Granted Sep 25, 2007·1 cites·7 claims
- 0955US11380646B2Multi-sided cooling semiconductor package and method of manufacturing the sameLITE ON SEMICONDUCTOR CORP·Filed 2020·Granted Jul 5, 2022·0 cites·39 claims
- 1048US6921967B2Reinforced die pad support structureAMKOR TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·9 cites·20 claims
- 1147US2021358833A1Direct cooling power semiconductor packageLITE ON SEMICONDUCTOR CORP·Filed 2020·Application pending·0 cites
- 1246US2010102429A1Flip-chip package structure with block bumps and the wedge bonding method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Application pending·0 cites
- 1344US2007145605A1Chip packaging structure without leadframeTZU CHUNG-HSING·Filed 2007·Application pending·0 cites
- 1443US6211563B1Semiconductor package with an improved leadframeSAMPO SEMICONDUCTOR COOPERATIO·Filed 1999·Granted Apr 3, 2001·14 cites·19 claims
- 1543US2010133671A1Flip-chip package structure and the die attach method thereofTZU CHUNG HSING·Filed 2009·Application pending·0 cites
- 1643US2009109194A1Touch ScreenLUNGHWA UNIVERSITY OF SCIENCE·Filed 2008·Application pending·0 cites
- 1743US2010133668A1Semiconductor device and manufacturing method thereofTZU CHUNG HSING·Filed 2009·Application pending·0 cites
- 1842US2013070427A1Pre molded can packageTZU CHUNG HSING·Filed 2012·Application pending·0 cites
- 1942US2007020964A1Memory module with chip hold-down fixtureDOMINTECH CO LTD·Filed 2005·Application pending·0 cites
- 2042US2006171126A1Memory card with memory chip replaceableDOMINTECH CO LTD·Filed 2005·Application pending·0 cites
- 2141US2010123243A1Flip-chip chip-scale package structureGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Application pending·0 cites
- 2240US2011031302A1Flip-chip package structure with block bumps and the wedge bonding method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 2339US2015195919A1Intelligent Power Module ProcessTZU CHUNG HSING·Filed 2014·Application pending·0 cites
- 2439US2006138628A1Stack chip packageDOMINTECH CO LTD·Filed 2005·Application pending·0 cites
- 2539US2006131742A1Packaged chip capable of lowering characteristic impedanceFINE TECH INC·Filed 2005·Application pending·0 cites
- 2638US2008169541A1Enhanced durability multimedia cardMIKS JEFFREY ALAN·Filed 2005·Application pending·0 cites
- 2737US9520343B1Field-effect transistor structure for preventing from shortingTZU CHUNG HSING·Filed 2015·Granted Dec 13, 2016·0 cites·6 claims
- 2836US2013070424A1Molded can packageTZU CHUNG HSING·Filed 2012·Application pending·0 cites
- 2936US2006017146A1IC with stably mounted chipTZU CHUNG-HSING·Filed 2005·Application pending·0 cites
- 3035US2012103668A1Chip PackageTZU CHUNG HSING·Filed 2011·Application pending·0 cites
- 3133US6101101AUniversal leadframe for semiconductor devicesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Aug 8, 2000·7 cites·1 claims
- 3232US2011049692A1Connection device bewteen transistor and lead frameGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 3332US2011127658A1Muti Thickness Lead FrameGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 3431US5998857ASemiconductor packaging structure with the bar on chipSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Dec 7, 1999·3 cites·3 claims
- 3529US2016284634A1Semiconductor transistor package structureTZU CHUNG HSING·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →