Inventor · disambiguated record
Chee Mun Wai
Also filed as: WAI CHEE MUN
0 granted patents·2 pending applications·0 citations·filing 2022–2025
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0148US2025293127A1Leadframe panel, a semiconductor package comprising a leadframe with a two-level dambar design and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0244US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →